Nvidia explores glass substrates for advanced AI chip packaging
Nvidia is reportedly considering the use of glass substrates in its AI chips to enable higher stacking of High Bandwidth Memory (HBM). This development, initially reported by Seoul Economic Daily, suggests a potential shift in advanced packaging technology. The news also led to a surge in SCHMID's stock, a company involved in glass substrate technology, as AMD and Intel are also said to be exploring similar options.
2 articles from 2 outlets covered this story. The underlying claim is sourced from a rumor.
What do all outlets agree on?
2 outlets covered “Nvidia explores glass substrates for advanced AI chip packaging”. All of them report the following:
- Nvidia is considering glass substrates
- Glass substrates would allow stacking more HBM on AI chips
- AMD and Intel are also considering using glass substrates
- SCHMID is a company involved in glass substrate technology
Which outlets covered this?
All 2 articles found on this story, grouped by the stance of the piece. Every link goes to the original publisher.
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